Gold Paste

Product Description

Gold paste is a conductive material with stable quality that is widely used in microelectronic packaging and thick-film integrated circuits. It consists of gold powder and a suitable organic carrier system. Leveraging the good electrical conductivity and chemical stability of gold，this material is suitable for electronic components that demand high signal integrity and environmental stability. JFM offers gold paste products that meet customer requirements for stable electrical connections，suitable wire bonding，and long-term reliability.

Gold paste is suitable for high-density circuits and high-stability packaging applications，offering the following characteristics:

Gold paste is primarily used in the following electronic component and circuit interconnection applications:

For high-reliability circuit routing，multi-layer interconnections and interlayer connections.
Suitable for the fabrication of electrodes in high-power components such as RF and microwave devices.
For sensitive electrodes requiring high stability and strict oxidation resistance.
Suitable for internal conductive and signal connections in high-density optoelectronic devices.
Used in screen printing，specifically designed for printing high-precision electrodes in sensor applications.

Parameter Category	Capabilities & Features
Material System	Gold-based Paste
Physical Form	Homogeneous slurry with specific viscosity and rheological properties
Applications	Circuit patterning，wire bonding，electrode fabrication and high-reliability thin-film deposition
Compatible Processes	Compatible with standard screen printing and a variety of sintering/curing processes

* For further product information and application support, please contact us

Conductive Adhesive