Platinum-based Alloy Wire

Platinum-based Alloy Wire
Platinum-based Alloy Wire
Platinum-based Alloy Wire
Platinum-based Alloy Wire
Platinum-based Alloy Wire
Platinum-based Alloy Wire
  •  Product Description

    Platinum-based alloy wires combine high-purity platinum with elements such as iridium and nickel to offer a high melting point, stable chemical inertness, and good mechanical strength. They provide stable electrical performance under complex operating conditions in fields including semiconductor wafer testing, power device aging tests, and precision sensing. JFM’s range of platinum-based alloy wires is designed to meet the stringent requirements of the industrial sector regarding material purity, dimensional consistency and long-term stability in corrosive environments.

 Key Features

Platinum-based alloy wires are suitable for probe tips and micro-contact components, offering the following characteristics:

  • Good chemical stability and corrosion resistance
  • High mechanical strength and hardness
  • Good high-temperature stability
  • Stable signal transmission capability
  • High-precision dimensional control and guaranteed purity

 Application Areas

Platinum-based alloy wires are primarily used in the following semiconductor manufacturing, precision sensing and industrial testing applications:

  • Semiconductor testing: Used in high-temperature wafer test probe cards, ageing test sockets and vertical probe assemblies
  • High-power module testing: Suitable for high-temperature performance evaluation of third-generation semiconductor devices
  • Precision Sensors: Used in oxygen sensors, pressure sensors, and core sensing elements of high-temperature thermocouples
  • Electrochemistry and Analysis: Used for electrical connections in industrial electrodes, conductivity cells and precision analytical systems
  • High-end industrial electronics: Used in electrical contact components for medical devices, precision instruments and other fields

 Product Specifications

Parameter Category Capabilities & Features
Material System Utilizes platinum and platinum-based alloy systems; selection can be tailored to probe structure and test conditions
Physical Form High-precision straight or coiled wire is available, with good surface finish
Purity Grades Wire of various purity grades can be customized to meet specific requirements
Wire Diameter and Specification Range A wide range of wire diameters and specifications are available to suit different probe types and fine-pitch structure requirements
Suitable processes Suitable for precision machining, micro-tipping and automated wire bonding processes 
Applications Suitable for probe manufacturing applications such as semiconductor wafer testing and packaging testing

* For further product information and application support, please contact us

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