Platinum-based alloy wires combine high-purity platinum with elements such as iridium and nickel to offer a high melting point, stable chemical inertness, and good mechanical strength. They provide stable electrical performance under complex operating conditions in fields including semiconductor wafer testing, power device aging tests, and precision sensing. JFM’s range of platinum-based alloy wires is designed to meet the stringent requirements of the industrial sector regarding material purity, dimensional consistency and long-term stability in corrosive environments.
Platinum-based alloy wires are suitable for probe tips and micro-contact components, offering the following characteristics:
Platinum-based alloy wires are primarily used in the following semiconductor manufacturing, precision sensing and industrial testing applications:
| Parameter Category | Capabilities & Features |
| Material System | Utilizes platinum and platinum-based alloy systems; selection can be tailored to probe structure and test conditions |
| Physical Form | High-precision straight or coiled wire is available, with good surface finish |
| Purity Grades | Wire of various purity grades can be customized to meet specific requirements |
| Wire Diameter and Specification Range | A wide range of wire diameters and specifications are available to suit different probe types and fine-pitch structure requirements |
| Suitable processes | Suitable for precision machining, micro-tipping and automated wire bonding processes |
| Applications | Suitable for probe manufacturing applications such as semiconductor wafer testing and packaging testing |
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