High-purity gold sputtering target

High-purity gold sputtering target
High-purity gold sputtering target
High-purity gold sputtering target
High-purity gold sputtering target
High-purity gold sputtering target
High-purity gold sputtering target
  •  Product Description

    High-purity gold targets are commonly used as electrodes and metallization materials in physical vapor deposition (PVD) processes,and are applicable in fields such as semiconductor manufacturing,thin-film circuits and precision optical coatings. JFM offers high-quality gold target products. Through strict control of material purity and microstructure,these targets exhibit stable deposition performance during the sputtering process. The products meet customer requirements for film quality,process consistency and electrical connection stability in relevant applications.

 Key Features

High-purity gold targets are primarily used in the following thin-film deposition and metallization applications:

  • Good electrical and thermal conductivity
  • Stable chemical properties
  • Uniform sputtering deposition rate
  • Good film adhesion and deposition uniformity
  • Contributes to improved process stability

 Application Areas

High-purity gold targets are primarily used in the following thin-film deposition and metallization applications:

  • Semiconductor metallization: film deposition for wafer interconnects,barrier layers and ohmic contact layers
  • Optoelectronic devices: preparation of reflective layers and electrode contacts for laser diodes and light-emitting diodes
  • Precision sensors: Fabrication of lead-out electrodes for MEMS sensors,pressure sensors and sensing elements
  • Surface functional coatings: Conductive films and protective layers for the telecommunications,precision instrumentation and electronic components sectors
  • Research and analysis: Gold sputtering for SEM samples and high-precision laboratory R&D applications

 Product Specifications

Parameter Category Capabilities & Features
Material System High-purity gold sputtering targets
Physical Form Custom shapes available to suit equipment requirements
Deposition Characteristics Stable sputtering rate with good film uniformity
Applications Electrode fabrication,chip metallization,reflective layer deposition and functional film growth
Compatible processes Suitable for magnetron sputtering,ion beam sputtering and physical vapor deposition (PVD) processes
Dimensions available Customized dimensions available to suit specific equipment models and process requirements

* For further product information and application support, please contact us

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