Ceramic Leadless Chip Carrier(CLCC)
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Product Description
Ceramic leadless chip carrier (CLCC) packages are suitable for high‑density surface mounting. They have low parasitic effects, small size, light weight, good heat dissipation, and high reliability.They are available with pads on two sides or four sides, with pitches of 1.27 mm and 1.00 mm. They are used to package various VLSI, ASIC, and ECL circuits.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- Glass-ceramics
- Kovar
- W-Mn or Mo-Mn Thick-Film Metallization
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Applications
Product Properties
Low Signal Noise
Good Heat Flow
Mechanical Shock Resistant
Long-term Environmental Stability
Compatible with High‑density PCB Routing
High Hardness
Superior Insulation
Low Resistivity
Excellent Corrosion Resistance
Excellent Moisture Resistance
High EMI Shielding Capability
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
C04D2-01 |
4.40×7.00 |
— |
6.50×4.20 |
2.50×3.00 |
2.40 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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