Ceramic Small Outline Package(CSOP)
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Product Description
CSOP is a compact SMT package designed for high reliability. Its wing-shaped (gull-wing) leads effectively absorb stress and resist mechanical shocks, ensuring a stable connection to the PCB.Standard lead pitch is 1.27 mm, with optional 1.00, 0.80 and 0.65 mm fine pitches. It is hermetic, moisture‑resistant and highly reliable, suitable for amplifiers, memory and comparator ICs, and covering a variety of application scenarios including integrated circuits, hybrid circuits, and solid-state relays.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- HTCC
- W-Mn or Mo-Mn Thick-Film Metallization
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Applications
Product Properties
Superior Thermal Stress Relief
Strong Long-term Stability
Good Noise Suppression
Easy to Test and Rework
High Shock & Vibration Resistance
Extra Long Service Life
Superior Insulation
Low Resistivity
Good Corrosion Resistance
Good Moisture Resistance
High EMI Shielding Capability
Low Coefficient of Thermal Expansion
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
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CSOP04-02 |
5.40×3.60×1.50 |
1.27 |
3.50×3.60 |
1.50×1.60 |
1.7 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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