Company News 2026-03-13
Why is the CDIP Package Still Widely Used in Semiconductor Devices?
Despite the rise of surface-mount technologies, the Ceramic Dual In-line Package (CDIP) remains a cornerstone for high-reliability electronics. This article explores the technical structure, hermetic sealing advantages, and thermal stability of CDIP.
Company News 2025-11-18
Announcement: Registered Address Update
JFM has moved to Uchikanda, Tokyo. Our fine & precision materials supply and all contact details remain unchanged. Trust your expert supplier for reliable service.
Company News 2024-04-20
Participation Notice: High-Performance Materials Week 2024 Osaka
We will be exhibiting at the "High-Performance Materials Week," which will be held at Intex Osaka from May 8 to May 10, 2024.
