Ceramic Flat Package(CFP)
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Product Description
Ceramic Flat Packs (CFPs) are characterized by their compact size, lightweight, high packaging density, easy mounting, and superior reliability. While the standard lead pitch is 1.27 mm, we offer customizable narrow-pitch options of 1.0, 0.8, and 0.5 mm, with the capability to integrate heat sink structures. This format is ideal for surface-mount technology (SMT) and is widely used in space-sensitive applications such as optocouplers, Hall effect sensors, and high-density discrete devices.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- Glass-ceramic Composites
- Kovar
- W-Mn or Mo-Mn Metallization Layers
- Gold-Tin (Au-Sn)
- Copper (Cu)
- Tungsten-Copper (W-Cu)
- Molybdenum-Copper (Mo-Cu)
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Applications
Product Properties
Good high-frequency electrical performance
Hermetic packaging
High thermal cycling reliability
Resistant to mechanical shock and vibration
Compatible with surface-mount processes
Good long-term stability
Superior Corrosion Resistance
Low Coefficient of Thermal Expansion
Good Moisture Resistance
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
F04-03 |
4.80×6.00 |
2.54 |
5.90×4.70 |
3.00×2.20 |
1.50 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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