Ceramic Pin Grid Array Package(CPGA)
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Product Description
Ceramic Pin Grid Array(CPGA) is a common plug‑in package for VLSI chips. It has high packing density, good electrical and thermal performance, good air tightness, and high reliability. The usual pin pitch is 2.54 mm, in either regular or staggered rows. There are two structures: cavity‑up and cavity‑down. Cavity‑down makes it easy to mount a heatsink on the back, which improves heat dissipation. With cavity‑up, the cavity can be made larger, which is good for large chips or multi‑chip modules. CPGA packages are mainly used for CPUs, DSPs, CCDs, ASICs and other VLSI chips.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- Glass-ceramics
- Kovar
- W-Mn or Mo-Mn Thick-Film Metallization
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Applications
Product Properties
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
G15-01 |
21.5×19.00 |
2.54 |
21.50×19.00 |
5.00×5.00 |
2.20 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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