SMD Package
-
Product Description
SMD package series is widely utilized for various medium and high-power diodes and transistors. Constructed with a ceramic base and integrated with Copper-Tungsten (W-Cu) or Molybdenum-Copper (Mo-Cu) for thermal management, these packages offer a compact footprint, high reliability, and superior heat dissipation. We provide advanced Nickel-Gold (Ni/Au) plating processes to significantly enhance bonding reliability, meeting the stringent requirements for high-power Silicon-Aluminum (Si-Al) wire bonding.
-
Corresponding Materials
- Alumina
- Aluminum Nitride
- Tungsten-Copper
- Molybdenum-Copper
- Oxygen-Free Copper
- Tungsten-Manganese Thick-Film Metallization
-
Applications
Product Properties
Good heat dissipation performance
Resistant to environmental aging
long service life
Good electromagnetic compatibility
Supports high current-carrying capability
Strong long-term operational stability
Good electrical performance
Good corrosion resistance
High Impact Resistance
Low Coefficient of Thermal Expansion
Good Moisture Resistance
Material property table
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
REQUEST A QUOTE
