Gold-Tin (AuSn) Alloy Solder Lid
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Product Description
Featuring Au80Sn20 alloy solder and Ni/Au plating, these lids are designed for the hermetic packaging of high-reliability ICs, microwave devices, and MEMS. Using a reflow sealing process, they offer low packaging stress, high reliability, and excellent resistance to harsh environments. With nearly 500 specifications available—including a minimum size of 2.40mm × 2.40mm and a solder width as narrow as 0.35mm—we meet diverse requirements for high-density packaging.
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Corresponding Materials
- Kovar Alloy
- Iron‑Nickel‑Cobalt Alloy
- Copper‑Tungsten (CuW)
- Molybdenum‑Copper (MoCu)
- Eutectic Alloy
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Applications
Product Properties
Low thermal stress
High hermeticity and long-term stability
Radiation resistance and anti-aging performance
Supports multifunctional integrated designs
Compatible with automated packaging/assembly lines
Superior Insulation
Low Resistivity
Good Corrosion Resistance
Good Moisture Resistance
High EMI Shielding Capability
Low Coefficient of Thermal Expansion
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