Ceramic Land Grid Array Package(CLGA)
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Product Description
CLGA packages are widely used in high-performance chips like microprocessors, controllers, and CPUs. Thanks to their high-density layout, excellent electrical and thermal properties, and hermetic sealing, they are also an ideal choice for high-end Hall sensors, specialized ASICs, and high-reliability discrete modules.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- HTCC
- W-Mn or Mo-Mn Thick-Film Metallization
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Applications
Product Properties
Leadless design reduces parasitic effects
Good planar heat conduction capability
Good vibration resistance
High stability and anti-aging
Superior Insulation
Low Resistivity
Good Corrosion Resistance
Good Moisture Resistance
High EMI Shielding Capability
Low Coefficient of Thermal Expansion
Supports high density interconnects and power integrity
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
CLGA48-01 |
8.00×8.00 |
— |
8.00×8.00 |
4.60×4.60 |
1.30 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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