Ceramic Quad Flat Package (CQFP)
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Product Description
Ceramic Quad Flat Packages (CQFP) feature a compact size, lightweight design, and high packaging density with excellent thermal and electrical performance, making them ideal for surface-mount technology (SMT). Common lead pitches include 1.27mm, 1.00mm, 0.80mm, 0.65mm, and 0.50mm. These packages are suitable for various large-scale integrated circuits (LSIs), such as ECL and CMOS gate arrays, and are also widely utilized in optocouplers, Hall effect sensors, and solid-state relays (SSRs) with stringent reliability requirements.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- Glass-ceramics
- Kovar
- W-Mn or Mo-Mn Thick-Film Metallization
- Gold-Tin
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Applications
Product Properties
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
Q18-01H |
9.40×13.90 |
1.27 |
13.80×9.30 |
4.40×8.90 |
1.40 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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