Bonding & Evaporation Materials
-
Product Description
Bonding/evaporation materials are key foundational materials used to achieve electrical connections, electrode contacts and the deposition of functional films during semiconductor chip manufacturing and microelectronic packaging processes. We can supply high-purity precious metals and a variety of eutectic alloys, including gold wire, high-purity gold, gold-germanium, gold-tin and gold-silicon, available in various forms such as wire, granules and sheets. These materials meet the stringent requirements for purity, composition and stability demanded by physical vapour deposition (PVD) processes and high-performance microelectronic bonding processes.
Advantages
- Good electrical and thermal conductivity，coupled with reliable interfacial bonding capabilities
- Low impurity content，ensuring consistent film quality and stable electrical performance
- Wide process compatibility，meeting the requirements of thermal evaporation，electron beam evaporation and various bonding and packaging applications
- Contributes to improved device yield and long-term operational reliability
- Meets the application requirements for high-performance materials in the fields of microelectronics，optoelectronics and power semiconductors
Applications
- Used in semiconductor thin-film deposition and vacuum coating processes，utilising PVD evaporation to prepare functional metal and alloy thin-film layers.
- Suitable for precision bonding and interconnection in device assembly，meeting requirements for structural fixation and electrical connectivity.
- Used for hermetic sealing and encapsulation connections of precision components，meeting packaging requirements across different process routes.
- Widely used in high-power devices
- sensors，optical communications and high-reliability electronics manufacturing.
Gold Bonding Wire
Gold bonding wire evaporation materials are prepared from high-purity gold raw materials and serve as the foundational material for physical vapour deposition (PVD) processes. Through thermal or electron beam evaporation，uniform，dense pure gold films can be deposited onto substrates. With good electrical conductivity，chemical stability and consistent infrared reflectance，these materials are widely used in the semiconductor，optoelectronics and high-end manufacturing sectors. JFM offers gold wire evaporation materials in a variety of purity grades and physical forms，providing stable，high-yield material solutions for precision coating processes.
High-Purity Gold
High-purity gold is a material commonly used in the semiconductor，optoelectronics and precision manufacturing sectors. Its good electrical conductivity，chemical inertness and process stability make it suitable for the production and fabrication of high-quality，highly stable components. JFM specializes in supplying high-purity gold materials and，in accordance with customers’ process requirements (such as PVD and bonding)，offers a range of product forms including evaporation particles，sputtering targets and high-purity gold wires，helping to ensure consistent performance and stable yield across various processes.
Gold-Germanium Alloy
Gold-germanium alloys are crucial thin-film deposition and packaging materials in semiconductor manufacturing. Utilizing physical vapor deposition (PVD) processes，AuGe films are commonly employed in the fabrication of ohmic contact electrodes for semiconductor devices. Following low-temperature annealing，the film forms an alloyed structure with the semiconductor substrate，optimizing contact resistance and meeting the process requirements for high-quality RF devices，optoelectronic devices and microwave components. JFM offers gold-germanium alloy materials in various forms，along with selection guidelines，to meet application requirements for clean production，connection consistency and long-term stability.
Gold-Tin Alloy
Gold-tin (AuSn) alloy is a well-balanced thin-film deposition material widely used in physical vapor deposition (PVD) processes，with proven application in thermal evaporation and electron beam evaporation scenarios. AuSn films formed via evaporation deposition retain the material’s inherent good thermal and electrical conductivity，moderate mechanical strength and corrosion resistance，meeting the requirements for the preparation of functional coatings and stable，weldable metal layers. JFM offers high-purity gold-tin evaporation materials in various forms，designed to meet customers’ standard technical requirements for film uniformity，process stability and the functionality of the deposited layer.
Gold-Silicon Alloy
Gold-silicon evaporation material is a high-purity alloy designed for physical vapor deposition (PVD) processes. Through thermal or electron beam evaporation，uniformly composed AuSi films can be deposited onto silicon substrates or chips. Leveraging its unique eutectic properties，this film enables stable，low-temperature，flux-free eutectic chip bonding. Due to its good compatibility with silicon，AuSi films are widely used in power devices，MEMS and high-stability packaging applications. JFM supplies high-purity gold-silicon evaporation materials with stable performance，meeting the requirements of precision deposition and bonding processes.
REQUEST A QUOTE
