Gold-Silicon Alloy
-
Product Description
Gold-silicon evaporation material is a high-purity alloy designed for physical vapor deposition (PVD) processes. Through thermal or electron beam evaporation，uniformly composed AuSi films can be deposited onto silicon substrates or chips. Leveraging its unique eutectic properties，this film enables stable，low-temperature，flux-free eutectic chip bonding. Due to its good compatibility with silicon，AuSi films are widely used in power devices，MEMS and high-stability packaging applications. JFM supplies high-purity gold-silicon evaporation materials with stable performance，meeting the requirements of precision deposition and bonding processes.
Key Features
Gold-silicon alloys are suitable for electronic packaging and precision interconnection applications，offering the following characteristics:
- Good eutectic melting properties
- Clean soldering process
- Good chemical stability
- Flexible supply options
- Good silicon-based compatibility and wettability
- High-purity raw materials
- Stable electrical properties of thin films
Application Areas
Gold-silicon evaporation materials are primarily used in the following thin-film deposition and device manufacturing applications:
- Chip mounting: Silicon integrated circuits，transistors，diodes and bonding to lead frames/ceramic substrates
- Power semiconductors: Fabrication of ohmic contact layers for power devices and thermal interface bonding
- Microelectronic integration: Reliable bonding of hybrid integrated circuit components
- Hermetic Sealing: Sealing connections for MEMS，pressure sensors and semiconductor sensing elements
- Industrial and communications electronics: Suitable for electronic components requiring stability，such as those used in telecommunications equipment and automated control systems
Product Specifications
| Parameter Category | Capabilities & Features |
| Material System | Gold-silicon eutectic alloy series |
| Physical Form | Granules，blocks，wire segments，etc.，suitable for various types of evaporation sources |
| Suitable Processes | Eutectic bonding/reflow assembly; thermal evaporation，electron beam evaporation coating |
| Applications | Silicon device chip mounting，precision bonding，thin-film deposition |
| Customization Capabilities | We offer customized products in a variety of sizes and shapes to meet customer requirements |
* For further product information and application support, please contact us
REQUEST A QUOTE
