Gold-Germanium Alloy
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Product Description
Gold-germanium alloys are crucial thin-film deposition and packaging materials in semiconductor manufacturing. Utilizing physical vapor deposition (PVD) processes，AuGe films are commonly employed in the fabrication of ohmic contact electrodes for semiconductor devices. Following low-temperature annealing，the film forms an alloyed structure with the semiconductor substrate，optimizing contact resistance and meeting the process requirements for high-quality RF devices，optoelectronic devices and microwave components. JFM offers gold-germanium alloy materials in various forms，along with selection guidelines，to meet application requirements for clean production，connection consistency and long-term stability.
Key Features
Gold-germanium alloys are suitable for semiconductor and electronic packaging applications and possess the following characteristics:
- Good eutectic melting properties
- Good electrical contact performance
- Good wetting and bonding strength
- Chemical stability
- Good process compatibility
Application Areas
Gold-germanium evaporation materials are primarily used in semiconductor thin-film deposition and device manufacturing applications:
- Optoelectronic device assembly: chip mounting and encapsulation for lasers，LEDs，detectors，etc.
- Gas-tight sealing: Suitable for packaging structures requiring high sealing performance and environmental stability
- Compound semiconductor ohmic contacts: Used in annealing and alloying processes to form low-resistance contact structures
- Thin-film deposition: Suitable for thermal evaporation，electron beam evaporation and process development using granular or block-form raw materials
Product Specifications
| Parameter Category | Capabilities & Features |
| Material System | Gold-Germanium eutectic alloy |
| Physical Form | Granules，lumps，strands，rods and other forms，suitable for a wide range of evaporation sources |
| Compatible processes | Eutectic bonding，reflow sealing; thermal evaporation，electron beam evaporation coating |
| Applications | Chip mounting，eutectic bonding，ohmic electrode preparation and alloy film deposition |
* For further product information and application support, please contact us
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