Gold Bonding Wire
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Product Description
Gold bonding wire evaporation materials are prepared from high-purity gold raw materials and serve as the foundational material for physical vapour deposition (PVD) processes. Through thermal or electron beam evaporation，uniform，dense pure gold films can be deposited onto substrates. With good electrical conductivity，chemical stability and consistent infrared reflectance，these materials are widely used in the semiconductor，optoelectronics and high-end manufacturing sectors. JFM offers gold wire evaporation materials in a variety of purity grades and physical forms，providing stable，high-yield material solutions for precision coating processes.
Key Features
Gold wire is suitable for wire bonding applications in microelectronic packaging and possesses the following characteristics:
- High purity and good overall performance
- Good electrical conductivity
- Good antioxidant properties and stable infrared reflectance
- Consistent performance
- Wide range of product forms
Application Areas
Gold wire is primarily used in the following microelectronics packaging and wire bonding applications:
- Microelectronic metallization: preparation of electrode layers，contact layers，interconnect layers and seed layers
- Optical and functional coatings: reflective layers，infrared/visible light-related coatings，functional thin-film structures
- Research and device development: MEMS/sensors，electrical test structures，surface-functionalized films，etc
Product Specifications
| Parameter Category | Capabilities & Features |
| Material System | High-purity gold |
| Physical Form | Available in forms such as evaporation wires，granules and small blocks; customization available |
| Applications | Deposition of various metal films，including gold electrodes，conductive layers and reflective layers |
| Compatible Processes | Compatible with PVD processes such as vacuum thermal evaporation and electron beam evaporation |
| Storage Environment | Storage in a constant temperature and humidity environment is recommended to minimize impurity adhesion and surface contamination |
* For further product information and application support, please contact us
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