Gold-Tin Alloy
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Product Description
Gold-tin (AuSn) alloy is a well-balanced thin-film deposition material widely used in physical vapor deposition (PVD) processes，with proven application in thermal evaporation and electron beam evaporation scenarios. AuSn films formed via evaporation deposition retain the material’s inherent good thermal and electrical conductivity，moderate mechanical strength and corrosion resistance，meeting the requirements for the preparation of functional coatings and stable，weldable metal layers. JFM offers high-purity gold-tin evaporation materials in various forms，designed to meet customers’ standard technical requirements for film uniformity，process stability and the functionality of the deposited layer.
Key Features
Gold-tin evaporation materials are suitable for a wide range of thin-film deposition applications，and the deposited films exhibit the following characteristics:
- High purity and high performance
- Good thermal and electrical conductivity
- Moderate creep resistance，ensuring long-term connection stability
- Flux-free，clean process
- Good corrosion and oxidation resistance
- Stable eutectic melting characteristics
Application Areas
Gold-tin evaporation materials are primarily used in the following thin-film deposition and functional layer preparation applications:
- Solderable films: pre-deposition on chips/substrates，serving as a flux-free solderable layer
- Gas-tight packaging underlayers: Deposition on device covers / sockets，suitable for vacuum / laser sealing
- Functional coatings: Preparation of corrosion-resistant，oxidation-resistant and specific optical/electrical performance coatings
- Semiconductors and Optoelectronics: As packaging contact layers and interconnect materials
Product Specifications
| Parameter Category | Capabilities & Features |
| Material System | Gold-Tin Alloy Series |
| Physical Form | Granules，ingots，rods，drawn wire，etc.，suitable for various evaporation sources. |
| Melting Characteristics | Possess a defined eutectic melting point，enabling precise control of thermal processes |
| Suitable Processes | Thermal evaporation，electron beam evaporation |
| Applications | Thin-film deposition，preparation of functional coatings，formation of solderable metal layers，optical applications，semiconductor packaging |
| Customization Capabilities | We offer customized products in a variety of sizes，shapes and purities to meet customer requirements |
* For further product information and application support, please contact us
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