Ceramic Quad Flat No-Lead Package (CQFN)
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Product Description
Ceramic Quad Flat No-Lead Packages (CQFN) offer excellent electrical and thermal performance within a compact, lightweight form factor. Characterized by very low self-inductance and low internal trace resistance, they provide superior electrical integrity for high-speed and high-frequency circuits such as AD/DA converters and DDS. Beyond these, they are widely used for packaging SAW, RF, and microwave devices. Their compact structure is also perfectly suited for Hall effect devices, miniature optocouplers, and highly integrated discrete functional units.
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Corresponding Materials
- Alumina
- Aluminum Nitride
- LTCC
- HTCC
- W-Mn or Mo-Mn Thick-Film Metallization
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Applications
Product Properties
Material property table
| Product Model | Ceramic Body Size | Lead Pitch | Sealing Area | Die Attach Area | Total Thickness |
|
CQFN72-01 |
10.00×10.00×1.50 |
0.5 |
9.80×9.80 |
6.40×6.40 |
1.5 |
* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.
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