High-Purity Gold

High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
High-Purity Gold
  •  Product Description

    High-purity gold is a material commonly used in the semiconductor,optoelectronics and precision manufacturing sectors. Its good electrical conductivity,chemical inertness and process stability make it suitable for the production and fabrication of high-quality,highly stable components. JFM specializes in supplying high-purity gold materials and,in accordance with customers’ process requirements (such as PVD and bonding),offers a range of product forms including evaporation particles,sputtering targets and high-purity gold wires,helping to ensure consistent performance and stable yield across various processes.

 Key Features

JFM high-purity gold materials provide a reliable foundation for precision processes,featuring the following characteristics:

  • High purity,low impurities
  • Good electrical and thermal conductivity with high reflectivity
  • Good chemical inertness
  • Available in multiple forms,facilitating loading operations
  • and compatibility with a wide range of mainstream process equipment

 Application Areas

We offer high-purity gold materials in a range of specifications to suit various application processes:

  • Gold is used to form the electrode layer, contact layer, reflective film, and seed layer
  • Gold sputtering target, wafer metallization, optical thin film, functional protective film
  • High-purity gold wire, foil, sheets, internal wiring of chips, airtight packages, and precision electronic components

 Product Specifications

Parameter Category Capabilities & Features
Purity Grade A range of high-purity grades are available; selection can be made according to the specific application
Physical Form Available in granules,targets,wires,foils and other forms; custom specifications available on request
Compatible Processes Film deposition (thermal evaporation,electron beam evaporation,etc.); microelectronic interconnects (gold wires for bonding,etc.) 
Applications Preparation of gold thin-film electrodes,conductive layers and reflective layers; covering both R&D and mass production coating applications

* For further product information and application support, please contact us

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