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Rings

Rings

  • Product Description

    Specialists in high-reliability ceramic components for semiconductor processes. We offer key parts like focus rings, shadow rings, edge contact rings, chamber seal rings, and deposition rings for CVD/PVD, sputtering, etching, and ion implantation equipment. Using alumina, yttria, SiC, and AlN, our precision forming and sintering achieve superior plasma resistance and thermo-mechanical properties. We provide custom solutions—including material, design, machining, and surface treatment—to meet unique semiconductor equipment manufacturer requirements.

  • Product Properties

    Wear-Resistant
    Heat-Resistant
    Corrosion-Resistant
    High Thermal Insulation
    Insulating
    Environmentally Friendly
    High Hardness
    Long Lifespan

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  Alumina Zirconia Yttria Aluminum Nitride Silicon Nitride Silicon Carbide
Item (JFM) Unit JC-AZ025A JC-A995A JC-A990A JC-A995A JC-A997A JC-A997B JC-A999A JC-Z08 JC-ZA20 JC-Y100A JC-AN100A JC-AN180 JC-SN-GPS-01 JC-SN-GPS-02 JC-SC101
Physical Property  
Content % - 95.0% 99.0% 99.5% 99.7% 99.7% 99.9% - - - - - - - -
Colour   Milky White White White Milky White Milky White Milky White White Milky White Milky White Greyish White Milky White Greyish White Greyish White Greyish White Black
Density g/cm3 4.4 3.7 3.8 3.9 3.92 3.94 3.95 6.0 5.6 4.9 3.2 3.3 3.21 3.23 3.15
Mechanical Behavior  
Vickers Hardness GPa 15 13.7 15.2 16.0 17.2 17.2 17.5 12.5 10.5 6 11.2 10.5 13.5 14.8 23
Bending Strength Mpa 650 350 310 360 380 380 400 1000 750 130 220 320 720 900 500
Compressive Strength Mpa - - 2160 2350 2380 2400 2560 2100 2300 3000 450 - 3200 3200 3900
Young's Modulus GPa 320 320 360 370 380 380 380 200 200 160 310 320 300 310 420
Poisson's Ratio / 0.25 0.23 0.23 0.23 0.23 0.23 0.23 0.31 0.31 - 0.24 0.24 0.28 - 0.17
Fracture Toughness Mpa.m1/2 5 3-4 3-4 4 4.8 5 5.4 4.6 7.4 1.1 3.2 3.3 6.5 7 3.2
Thermal Property  
Coefficient of Thermal Expansion 10-6/°C 9 7.2 7.2 7.2 7.2 7.2 7.2 10.5 10 7.2 4.6 4.6 2.8 2.8 4.3
Thermal Conductivity W/(m.K) 19 24 29 32 32 32 34 3 3 14 120 180 26 28 160
Specific Heat Capacity J/(g.K) - 0.78 0.79 0.78 0.79 0.79 0.78 0.46 0.46 0.45 0.72 0.72 0.64 0.64 0.67
Maximum Operating Temperature °C 1600 1500 1600 1600 1600 1600 1600 2200 1600 1800 800 800 1200 1200 1600
Electrical Property  
Dielectric Strength kv/mm - 15 15 15 15 15 15 11 13 11 16 14 13 13 -
Dielectric Constant （1MHz）  - - 9.4 9.9 9.9 9.9 9.9 9.9 33 28 11 8.5 8.6 9.6 9.6 -
Dielectric Losses （1MHz） （X10-4） - 4 2 1 1 1 1 16 17 5 2 3 3 3 -
Volume Resistivity 20℃ Ω.cm >1012 >1014 >1014 >1014 >1014 >1014 >1014 1013 >1014 >1013 >1014 >1014 >1014 >1014 108
Volume Resistivity 300℃ Ω.cm - 1010 1010 1013 1013 1013 1013 106 106 1010 1011 1010 1012 1012 -

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

  • Density
  • Flexural Strength
  • Compressive Strength
  • Young's Modulus
  • Fracture Toughness
  • Thermal Expansion
  • Thermal Conductivity
  • Specific Heat
  • Max. Service Temp.
  • Dielectric (1MHz)

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

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