Windows

Windows

  • Product Description

    Ceramic windows are essential in semiconductor etching machines, ensuring vacuum sealing and stability in harsh conditions involving high temperatures and acid-alkali corrosion. JFM offers customized solutions using high-purity alumina and yttria materials, utilizing precise forming, sintering, machining, and surface treatment to meet stringent industry standards and extreme environments.

  • Product Properties

    Abrasion Resistance
    Heat Resistance
    Corrosion Resistance
    Plasma Corrosion Resistance
    High Strength and High Hardness

Technical support

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  Alumina Yttria
Item (JFM) Unit JC-AZ025A JC-A995A JC-A990A JC-A995A JC-A997A JC-A997B JC-A999A JC-Y100A
Physical Property  
Content % - 95.0% 99.0% 99.5% 99.7% 99.7% 99.9% -
Colour   Milky White White White Milky White Milky White Milky White White Greyish White
Density g/cm3 4.4 3.7 3.8 3.9 3.92 3.94 3.95 4.9
Mechanical Behavior  
Vickers Hardness GPa 15 13.7 15.2 16.0 17.2 17.2 17.5 6
Bending Strength Mpa 650 350 310 360 380 380 400 130
Compressive Strength Mpa - - 2160 2350 2380 2400 2560 3000
Young's Modulus GPa 320 320 360 370 380 380 380 160
Poisson's Ratio / 0.25 0.23 0.23 0.23 0.23 0.23 0.23 -
Fracture Toughness Mpa.m1/2 5 3-4 3-4 4 4.8 5 5.4 1.1
Thermal Property  
Coefficient of Thermal Expansion 10-6/°C 9 7.2 7.2 7.2 7.2 7.2 7.2 7.2
Thermal Conductivity W/(m.K) 19 24 29 32 32 32 34 14
Specific Heat Capacity J/(g.K) - 0.78 0.79 0.78 0.79 0.79 0.78 0.45
Maximum Operating Temperature °C 1600 1500 1600 1600 1600 1600 1600 1800
Electrical Property  
Dielectric Strength kv/mm - 15 15 15 15 15 15 11
Dielectric Constant 1MHz  - - 9.4 9.9 9.9 9.9 9.9 9.9 11
Dielectric Losses 1MHz X10-4 - 4 2 1 1 1 1 5
Volume Resistivity 20 Ω.cm >1012 >1014 >1014 >1014 >1014 >1014 >1014 >1013
Volume Resistivity 300 Ω.cm - 1010 1010 1013 1013 1013 1013 1010

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

  • Density
  • Flexural Strength
  • Compressive Strength
  • Young's Modulus
  • Fracture Toughness
  • Thermal Expansion
  • Thermal Conductivity
  • Specific Heat
  • Max. Service Temp.
  • Dielectric (1MHz)

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

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