Vacuum Chuck

Vacuum Chuck

  • Product Description

    Ceramic vacuum chucks made from porous ceramics, alumina, and silicon carbide feature high thermal conductivity, insulation, corrosion resistance, and low thermal expansion. They are widely used in semiconductor wafer manufacturing, enabling uniform wafer attachment, preventing electrostatic damage, and ensuring easy cleaning and maintenance.

  • Product Properties

    High Temperature Resistance
    Abrasion Resistance
    Rotten Resistance
    High Invasiveness
    High Strength And High Hardness

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    Alumina Silicon Carbide
Item (JFM) Unit JC-AZ025A JC-A995A JC-A990A JC-A995A JC-A997A JC-A997B JC-A999A JC-SC101
Physical Property  
Content % - 95.0% 99.0% 99.5% 99.7% 99.7% 99.9% -
Colour   Milky White White White Milky White Milky White Milky White White Black
Density g/cm3 4.4 3.7 3.8 3.9 3.92 3.94 3.95 3.15
Mechanical Behavior  
Vickers Hardness GPa 15 13.7 15.2 16.0 17.2 17.2 17.5 23
Bending Strength Mpa 650 350 310 360 380 380 400 500
Compressive Strength Mpa - - 2160 2350 2380 2400 2560 3900
Young's Modulus GPa 320 320 360 370 380 380 380 420
Poisson's Ratio / 0.25 0.23 0.23 0.23 0.23 0.23 0.23 0.17
Fracture Toughness Mpa.m1/2 5 3-4 3-4 4 4.8 5 5.4 3.2
Thermal Propert  
Coefficient of Thermal Expansion 10-6/°C 9 7.2 7.2 7.2 7.2 7.2 7.2 4.3
Thermal Conductivity W/(m.K) 19 24 29 32 32 32 34 160
Specific Heat Capacity J/(g.K) - 0.78 0.79 0.78 0.79 0.79 0.78 0.67
Maximum Operating Temperature °C 1600 1500 1600 1600 1600 1600 1600 1600
Electrical Property  
Dielectric Strength kv/mm - 15 15 15 15 15 15 -
Dielectric Constant 1MHz  - - 9.4 9.9 9.9 9.9 9.9 9.9 -
Dielectric Losses 1MHz X10-4 - 4 2 1 1 1 1 -
Volume Resistivity 20 Ω.cm >1012 >1014 >1014 >1014 >1014 >1014 >1014 108
Volume Resistivity 300 Ω.cm - 1010 1010 1013 1013 1013 1013 -

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

  • Density
  • Flexural Strength
  • Compressive Strength
  • Young's Modulus
  • Fracture Toughness
  • Thermal Expansion
  • Thermal Conductivity
  • Specific Heat
  • Max. Service Temp.
  • Dielectric (1MHz)

* This data is an example of test results in lab. It may be different from the actual characteristics in a particular manufacturing process.

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