Ruthenium Sputtering Target
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Product Description
Ruthenium targets are commonly used precious metal sputtering materials in advanced semiconductor manufacturing，magnetic storage and precision electronics industries. With their high melting point，good electrical conductivity and corrosion resistance，they can be used as functional layers，barrier layers，gate electrodes and long-life electrode contacts. JFM offers ruthenium target products that meet customer requirements for film uniformity，process stability and deposition quality.
Key Features
Ruthenium targets are suitable for thin-film deposition applications and offer the following features:
- Good diffusion barrier properties
- Good corrosion and oxidation resistance
- High hardness and wear resistance
- Contributes to improved process stability
Application Areas
Ruthenium targets are primarily used in the following thin-film deposition and coating applications:
- Semiconductors and microelectronics: preparation of films for memory devices，integrated circuits and advanced interconnects
- Electronic functional films: deposition of metal films for electronic devices
- Flat-panel displays: Thin-film deposition and material validation for display devices
Product Specifications
| Parameter Category | Capabilities & Features |
| Material System | Ruthenium Sputtering Targets |
| Physical Form | Includes circular targets，rectangular targets and customized specifications to meet process requirements |
| Melting Characteristics | High melting point，good thermal stability |
| Applications | Deposition of diffusion barrier layers，metal gate processes，magnetic head manufacturing and the production of wear-resistant electrodes |
| Process compatibility | Suitable for magnetron sputtering，DC sputtering and various vacuum thin-film deposition methods |
| Dimensions and Availability | Compatible with mainstream physical vapor deposition (PVD) equipment and sputtering systems |
* For further product information and application support, please contact us
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