Ceramic Components for Wafer Planarization Process (CMP)

We specialize developing ceramic components for CMP applications in semiconductor and FPD production, including polishing platens, grinding discs, chucks, and other critical parts. Utilizing advanced ceramic materials such as alumina, silicon carbide, and zirconia, our precision-engineered CMP polishing components deliver exceptional corrosion resistance, wear resistance, high hardness, and thermal stability - enabling flawless surface planarization and the production of highly competitive, high-performance wafers for state-of-the-art wafer fabrication lines.